Breakthrough in traditional flexible film packaging technology involves the application of an ultra-thin photoresist film, specialized etching equipment, and chemicals to achieve a high etching factor with both line width and line spacing of 8 micrometers each. This allows for the design of more circuits within a fixed chip size, resulting in a panel with higher display performance.

By utilizing roll-to-roll equipment, a stable horizontal tension transmission and stable baking transmission system are designed. These key technological advancements, including ultra-high-precision OLB TTL Pitch expansion and contraction control techniques, enable the material roll to achieve expansion and contraction control within 0.03%. This significantly improves the yield and reliability of the produced COF carriers in IC bonding and glass lamination processes.

Furthermore, the use of flexible solder mask and circuit surface treatment methods enables the COF carrier to possess higher flexibility, resulting in higher reliability during the subsequent assembly process.