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We are a world-class, domestically leading high-tech enterprise specialized in the research, development, and production of new-type displays and flexible substrates.
Integrating Crystal and Cores, Guiding the Future of the Semiconductor Supply Chain
A single-sided flexible chip has a layer of chemically etched conductive pattern, which is made of rolled copper foil material. The insulating substrate can be made of materials such as polyimide, polyethylene terephthalate, aramid fiber ester, and polyvinyl chloride. The mold release and mass production performance are retained through single-sided (new etching, SAP) processes.
Breakthrough in traditional flexible film packaging technology involves the application of an ultra-thin photoresist film, specialized etching equipment, and chemicals to achieve a high etching factor with both line width and line spacing of 8 micrometers each. This allows for the design of more circuits within a fixed chip size, resulting in a panel with higher display performance.
By utilizing roll-to-roll equipment, a stable horizontal tension transmission and stable baking transmission system are designed. These key technological advancements, including ultra-high-precision OLB TTL Pitch expansion and contraction control techniques, enable the material roll to achieve expansion and contraction control within 0.03%. This significantly improves the yield and reliability of the produced COF carriers in IC bonding and glass lamination processes.
Furthermore, the use of flexible solder mask and circuit surface treatment methods enables the COF carrier to possess higher flexibility, resulting in higher reliability during the subsequent assembly process.

Core R&D indicators:

1. Fabrication Thickness Process for Roll-to-Roll Ultra-Thin Applications:Substrate thickness: 12.5~30 µ m;

2. Ultra-Fine Circuitry Fabrication Process:The minimum line width/line spacing can be 8 µ m;

3. High dimensional accuracy and stability process:Dimensional expansion and contraction accuracy is within 0.03%;

4. High Flexibility Fabrication Process:Can be folded 180 degrees ≥ 100 times