We have revolutionized conventional flexible film packaging technology through the adoption of ultra-thin photoresist coating, custom etching equipment and proprietary chemical solutions. This advanced process delivers a superior etching factor with precise 8μm line width and 8μm line spacing, enabling more circuit layouts within a given chip dimension and ultimately boosting overall panel display performance.Leveraging our specialized roll-to-roll production system equipped with stable horizontal tension transmission and constant-temperature baking transmission mechanisms, we have pioneered a full-roll ultra-high-precision OLB TTL pitch expansion and contraction control technology. It maintains a dimensional tolerance within 0.03%, which substantially raises the production yield of IC bonding and glass lamination for COF carrier products.Furthermore, we apply tailored flexible solder mask and professional circuit surface treatment technologies to optimize the flexibility of COF carriers. This structural enhancement ensures exceptional structural stability and long-term reliability throughout subsequent assembly and application processes.